Intel 740 Agp Driver Download Install Update
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document.
Added verbiage to 3. Restructured document and added a motherboard design: Chapter 2 contains the Addin Card design. Contact your field sales representative Literature order The basis of this document is a reference ATX card.
Introduction The reference design card described in this document contains the following features. Addin Card Design 2. This chip contains the following capabilities. The BtB contains four composite video inputs along with one chroma and one luma input for s-video.
A fence will minimize noise originating from digital signaling onto the analog signals. Addin Card Design Layout and Routing Guidelines This chapter describes layout and routing recommendations to insure a robust design. These guidelines should be followed as closely as possible. Any deviations from the guidelines listed here should be simulated to insure adequate margin is still maintained in the design. This is the placement used on the reference card. For NLX placement issues, refer to Section 5.
Addin Card Design Figure Thermal analysis requires that each V ball connect to an adjacent via which passes through to the solder side of the board, one via per ball, with a trace as wide as the via. The first three ball rows can be routed on the primary layer. The last two must be routed through vias to the secondary layer. These are electrically the same plane but should be separated by a fence, as described in Section 2.
AGP strobes must be separated by 2X normal signal spacing i. It is important to match clock lengths. Addin Card Design Configuration 2: Two rows of memory are supported in this configuration. Note that both rows of memory receive different copies of each control signal, for loading reasons.
Addin Card Design Configuration 3: Only the maximum allowable amount of memory 8MB is supported in this configuration. Note that each copied signal is sent to only two components. This interface is shared with the BIOS interface. Table gives the maximum trace lengths between components. Please read this section carefully to observe all design recommendations and requirements. The description of each schematic page is named by the logic block shown on that page.
Cover Sheet Schematic Page 1 The Cover Sheet shows the schematic page titles, page numbers, disclaimers and power pins. The regulator used in the reference design does not need any heat sink for the FET. As shown, the FET will be dissipating slightly over 1 watt. All power is derived from this connector. Using the rule of 1A per pin, the 12 volt supply is capable of supplying 1A, the 5 Volt supply is capable of supplying 2A and the 3.
Addin Card Design Video Connector Schematic Page 14 This page shows a specially designed solution to the problem of too many connectors and not enough board space. This 50 pin connector allows external hookup for a tuner, S-Video in, S-Video Out, composite video in, and composite video out.
This section also provides implementation issues associated with a 3-point AGP design and design recommendations which Intel feels will provide flexibility to cover a broader range of products within a market segment. The graphics controller that is used as the down device on the motherboard must have a mechanism that disables the device in a manner acceptable to the implementation of a logical point-to-point bus.
In this low power state, the Intel chip is disabled and will not initiate or respond to cycles on the AGP bus. In addition, the power consumption of this device in this state is less than 1 Watt. These two operating modes are 1X mode and 2X mode. Because 1X mode is a common clock mode, flight time of the signal is of the most importance. Among these issues are clock signal quality, routing, and clock skew.
Signal quality and routing are of a major concern since the clock now must be routed to both master components. It would be beneficial to have that design guide before tying to read this section. The stack up of the board is shown in Figure The benefit to the former method is that a solution space can be determined before any placement and routing is attempted. This saves time and effort over the method of route, simulate, adjust.
It is, therefore, recommended that the simulation results for the 3-load bus drive the layout and routing. They assume certain requirements in order to produce an AGP compliant placement and routing solution. These assumptions were used for the initial pre-route analysis of the design.
Control Signal and Clock Requirements Table The motherboard is divided into 2 trace segments as shown. These are referred to as segment A and B. Also, the strobes should be the longest signal in the group. Several vendors offer components that can be used in this design.
The dual-color LED circuit is also used to reduce the voltage going to the power supply fan, thus decreasing its speed and quieting the system. If the V plane is on an inner layer, keep the trace distance to the via as short as possible by placing the via between pins 6 and 7 for each resistor package. This page show the logic needed to put the Intel graphics accelerator into a low power state when a video add-in card is installed into the system.
In low power mode, the Intel chip is disabled and will not initiate or respond to cycles on the AGP bus. To perform the voltage translation, quick switches are used.
Voltage Regulator P This page shows the circuitry to convert from 3. The regulator used in the reference design does not need any heatsink for the FET. R must VID1 be removed. R R C C 2. Thursday, July 02, Thermal Considerations Thermal Considerations Thermal design is an important step in the total design process which must not be overlooked. Systems or cards designed without considering the thermal environment may experience failures.
The mounting holes must be nonplated but each must have a grounded annular ring on the solder side of the board surrounding the hole. This annular ring should have an inner diameter of mils and an outer diameter of mils. The reference card places the header at the bottom of the card. For other designs, these headers may be placed at the top of the board. The reference DVD daughter cards will be designed for a maximum graphics board component height of 0.
If the component height exceeds these dimensions underneath the daughter card, the daughter card may not fit. Mechanical Information Bracket Figure Recommended Bracket Placement Figure Unless a dual sided board is used, the full featured reference design will not be feasible on the NLX add-in card.
These designs can be modified so that the DVD component is down on the card or left as is so that multiple DVD solutions can be implemented. Figures Example of air exchange through a PC chassis Introduction In a system environment, the chipset temperature is a function of both the system and component thermal characteristics. The system level thermal constraints consist of the local ambient temperature at the component, the airflow over the component and surrounding board as well as the physical constraints at, above, and surrounding the component.
A package type defined by a resin-fiber substrate on which a die is mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. Please refer to these documents to verify the actual thermal specifications for the Intel graphics accelerator.
In general, systems should be designed to dissipate the highest possible thermal power. With the advent of Ball Grid Array BGA packaging for graphics accelerators, the majority of the thermal power dissipated by the chipset typically flows into the motherboard where it is mounted.
The heat generated by the components within the chassis must be removed to provide an adequate operating environment for all of the system components. To do so requires moving air through the chassis to transport the heat generated out of the chassis. This section will explore system cooling solutions as well as package heat-sinks. Due to their varying attributes, each of these solutions may be appropriate for a particular system implementation.
System Fans Fans are needed to move the air through the chassis. Note the recommended fan airflow directions in Figure 2 Figure The thermal performance of the Fan Heat Sink and Thermal Interface Material combined must be sufficient to maintain a case temperature at or below T See The Fan Heat Sink may use a connector which incorporates 2 separate connections:
Downloads for Graphics Drivers
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Added verbiage to 3. Restructured document and added a motherboard design:
Intel® Driver & Support Assistant (Intel® DSA)
The Intel , or i codenamed Auburn , is a nm graphics processing unit using an AGP interface released by Intel in Released with enormous fanfare, the i proved to have disappointing real-world performance  , and sank from view after only a few months on the market. The i has a long and storied history that starts at GE Aerospace as part of their flight simulation systems, notable for their construction of the Project Apollo "Visual Docking Simulator" that was used to train Apollo to dock the Command Module and Lunar Module. In January , Lockheed Martin re-organized their divisions and formed Real3D in order to bring their 3D experience to the civilian market. Real3D had an early brush with success, providing chipsets and overall design to Sega , who used it in a number of arcade game boards, the Model 2 and Model 3. They also formed a joint project with Intel and Chips and Technologies later purchased by Intel to produce 3D accelerators for the PC market, under the code name "Auburn". Auburn was designed specifically to take advantage of and promote the use of AGP interface, during the time when many competing 3D accelerators notably, 3dfx Voodoo Graphics still used the PCI connection. A unique characteristic, which set the AGP version of the card apart from other similar devices on the market, was the use of on-board memory exclusively for the display frame buffer , with all textures being kept in the computer system's main RAM.